Coating Manufacturer

LCM

As electronic products continue advancing toward thinner, lighter, and more precise designs, their internal structures are becoming increasingly complex and spatially constrained. Traditional assembly methods—such as welding and screw fastening—while mechanically robust, are gradually revealing limitations in areas such as weight, thickness, manufacturing efficiency, and compatibility.

Today, industrial tapes have increasingly replaced traditional fastening methods, becoming essential structural & functional solutions. These tapes not only provide reliable adhesion in multiple positions but also deliver electrical insulation, electromagnetic shielding, shock absorption and other functions. This ensures stable performance even under extreme environments and long‑term usage. Furthermore, the use of tapes reduces the need for mechanical machining and additional components, improves production efficiency, and lowers assembly tolerance risks—meeting the stringent requirements of modern electronic devices for lightweight, miniaturization, and high reliability.


Structural Fixation
Application Purpose:
  • Secure components in their intended positions
Application Area:
  • NB & Monitor bonding & fixation, to secure display panel to frame structure
  • FPC (flexible printed circuit) bonding & fixation
Applicable Material Selection:
  • Double-Sided Tape High bonding performance to various substrates, high shear strength, good die-cuttability, clean assembly
  • Double-Sided Differential Tape Different adhesives are designed for bonding to different substrates, or different adhesion levels are designed for different applications
Best in:
  • Display module bonding to frame, component fixation, general mounting
  • Bonding of dissimilar materials
Insulation
Application Purpose:
  • Prevents unwanted current flow, enhances safety by reducing short-circuit risks, and protects sensitive components
Application Area:
  • At the interface between the display and the main board, serving as an insulating layer to prevent conductive contact or friction
  • Applied beneath or on the reverse side of the FPC to insulate it from the metal base or mid-frame.
Applicable Material Selection:
  • PI (polyimide) PSA Tape High dielectric strength, high temperature resistance, excellent chemical resistance, and flame-retardant
  • PET PSA Tape Good dielectric strength, good mechanical strength, good temperature resistance
Best for:
  • High-temperature masking, requiring extreme durability, FPC protection
  • General insulation, bundling
EMI (electromagnetic interference shielding)
Application Purpose:
  • Prevents unwanted electromagnetic interference and maintain signal stability.
Application Area:
  • Positioned near antenna modules (including NFC, Wi-Fi, GPS, and 5G antennas) to mitigate interference from adjacent components
  • On the back side or along the edges of the display module (LCD/OLED), preventing display signal lines from causing interference to the main board or antenna
Applicable Material Selection:
  • Copper Foil PSA Tape Excellent electrical conductivity, extremely low contact resistance, excellent shielding effectiveness over a wide frequency range, soft & highly flexible
  • Aluminum Foil PSA Tape High electrical conductivity, excellent shielding effectiveness from mid-to-high frequency range (100MHz ~ 3GHz)
  • Conductive Fabric PSA Tape Good electrical conductivity, low & stable contact resistance due to nickel-plated surface which is resistant to oxidation, good shielding effectiveness in high frequency ranges, durable & conformable
  • Conductive Foam PSA Tape Good electrical conductivity after compression, good shielding effectiveness, excellent compression
Best for:
  • Grounding reinforcement high frequency signal areas, areas that require bending or compression
  • Metal housings or mechanical parts to provide large-area EMI shielding.
  • Wrapping around foam to serve as EMI grounding pads or strips, for grounding purpose, modules that require bending
  • Serves as an EMI cushioning pad or grounding pad (EMI gasket), provides gap filling to compensate height difference in device housing while providing a conductive path
Cushioning / Shock Absorption
Application Purpose:
  • To protect fragile modules; absorb impact and reduce compression between components
Application Area:
  • Applied along the display module frame to reduce assembly stress and protect the glass module.
Applicable Material Selection:
  • PU Foam PSA Tape Open cell structure, excellent softness & resilience, excellent cushioning and vibration damping, low compression force, long-term compression stability
  • PE Foam PSA Tape Closed cell structure, water & dust proof, good chemical resistance, ideal for gap filling & spacing & structural positioning
Best for:
  • Cushioning along display module frames, areas requiring repeated compression
Best in:
  • Gap filling between modules, structural positioning & spacing, large-area applications
Light Shielding
Application Purpose:
  • Blocks stray or light leakage to improve display quality while protecting internal components from light interference
Application Area:
  • In the display module backlight area, shielding the gaps between the backlight components (such as the light guide plate or LED strips) and surrounding mechanical parts
  • Applied around the camera module to prevent background light from entering the lens
  • Applied around the light sensor to block non-direct or stray light that may interfere with sensor operation
Applicable Material Selection:
  • Black / Matte Black / Black & White PET
  • Masking Tape Excellent light shielding, good temperature resistance, matte black color satisfies cosmetic requirement
  • Black / Matte Black PI Masking Tape Excellent light shielding, superior temperature resistance with high dimensional stability, matte black color satisfies cosmetic requirement
Best in:
  • General light blocking applications under moderate temperature conditions, large-area applications
  • Precision optical applications such as camera modules, light sensors, high-end display modules, and areas that require high temperature resistance
Heat Dissipation
Application Purpose:
  • Accelerate heat transfer away from heat sources, maintain component operating temperature within safe limits
Application Area:
  • Display modules, backlight LEDs, OLED drivers
Applicable Material Selection:
  • Thermal Pad Excellent thermal conductivity, gap filling, tolerance absorption
  • Thermal Tape Enhances heat transfer efficiency, improving interface contact to reduce thermal resistance, bonding components while transferring heat
Best in:
  • DDIC (Display Driver IC), T-CON (Timing Controller), LED bar
  • Laminating between components & metal backplate/ cover, to reinforce heat dissipation
Products
Product Adhesive Type Backing Material Total thickness